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Home > Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging


Book Informaton

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

Author

Ephraim Suhir; Y.C. Lee; C.P. Wong

Year of Publication

2007

Publisher

Springer US

City of Publication

New York

Pages

LXII, 1460

Language

EN

ISBN

9780387279749, 9780387329895, 0387279741

ARI Id

1664083757314


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Showing 1 to 20 of 51 entries
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i-xxxi
A1-A1
A3-A63
A65-A110
A111-A134
A135-A180
A181-A204
A205-A266
A267-A267
A269-A281
A283-A312
A313-A350
A351-A409
A411-A427
A429-A458
A459-A473
A475-A522
A523-A553
A555-A570
A571-A594
Chapters/HeadingsAuthor(s)PagesInfo
Showing 1 to 20 of 51 entries