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Home > Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability


Book Informaton

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability

Author

Kim S. Siow

Year of Publication

1st ed. 2019

Publisher

Springer International Publishing

Pages

XX, 279

Language

en

ISBN

9783319992556, 9783319992563, 3319992554

ARI Id

1665167224538


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