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Electrical modeling and design for 3D integration: 3D integrated circuits and packaging signal integrity,power integrity,and EMC


Book Informaton

Electrical modeling and design for 3D integration: 3D integrated circuits and packaging signal integrity,power integrity,and EMC

Author

Er-Ping Li

Year of Publication

2011

Publisher

Wiley-IEEE Press

City of Publication

Hoboken, N.J

Pages

394

Language

en

ISBN

OL25004738M, 9780470623466

ARI Id

1665627774645


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