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Home > Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC


Book Informaton

Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

Author

Er-Ping Li

Year of Publication

2012

Publisher

Wiley-IEEE Press

City of Publication

Hoboken, N.J

Language

en

ISBN

9780470623466, 9781118166758

ARI Id

1667598596791


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Showing 1 to 9 of 9 entries
Chapters/HeadingsAuthor(s)PagesInfo
Front Matter
Supplemental Images
Introduction
Macromodeling of Complex Interconnects in 3D Integration
2. 5D Simulation Method for 3D Integrated Systems
Hybrid Integral Equation Modeling Methods for 3D Integration
Systematic Microwave Network Analysis for 3D Integrated Systems
Modeling of Through-Silicon Vias (TSV) in 3D Integration
Index
Chapters/HeadingsAuthor(s)PagesInfo
Showing 1 to 9 of 9 entries