Home > Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
Book Informaton
Author
International Mechanical Engineering Congress and Exposition (1994 Chicago, Ill.)
Series
AMD;
Year of Publication
1994
Publisher
American Society of Mechanical Engineers
City of Publication
New York
Language
en
ISBN
0791814491, 0791814270, 0791814424
ARI Id
1668662236267
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