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Home > Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994


Book Informaton

Mechanics and materials for electronic packaging: presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994

Author

International Mechanical Engineering Congress and Exposition (1994 Chicago, Ill.)

Series

AMD;

Year of Publication

1994

Publisher

American Society of Mechanical Engineers

City of Publication

New York

Language

en

ISBN

0791814491, 0791814270, 0791814424

ARI Id

1668662236267


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