Search from the table of contents of 2.5 million books
Advanced Search (Beta)
Home > Materials, integration and packaging issues for high-frequency devices II: symposium held November 29-December 1, 2004, Boston, Massachusetts, U. S. A. /

Materials, integration and packaging issues for high-frequency devices II: symposium held November 29-December 1, 2004, Boston, Massachusetts, U. S. A. /


Book Informaton

Materials, integration and packaging issues for high-frequency devices II: symposium held November 29-December 1, 2004, Boston, Massachusetts, U. S. A. /

Author

Cho, Yong S.

Series

Materials Research Society symposium proceedings;

Volume

v. 833

Year of Publication

[2005], ©2005.

Publisher

Materials Research Society,

City of Publication

Warrendale, Pa

Pages

270

Language

en

ISBN

1558997814

ARI Id

1675767613696


Find on

World Cat

OpenLibrary

Internet Archive


This page has been accessed 5 times.
Asian Research Index Whatsapp Chanel
Asian Research Index Whatsapp Chanel

Join our Whatsapp Channel to get regular updates.

Citation Options
Download Citation

Showing 1 to 20 of 36 entries
Chapters/HeadingsAuthor(s)PagesInfo
Chapters/HeadingsAuthor(s)PagesInfo
Showing 1 to 20 of 36 entries