Home > Materials, integration and packaging issues for high-frequency devices II: symposium held November 29-December 1, 2004, Boston, Massachusetts, U. S. A. /
Materials, integration and packaging issues for high-frequency devices II: symposium held November 29-December 1, 2004, Boston, Massachusetts, U. S. A. /
Book Informaton
Author
Cho, Yong S.
Series
Materials Research Society symposium proceedings;
Volume
v. 833
Year of Publication
[2005], ©2005.
Publisher
Materials Research Society,
City of Publication
Warrendale, Pa
Pages
270
Language
en
ISBN
1558997814
ARI Id
1675767613696
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