Home > Materials, integration and packaging issues for high-frequency devices: symposium held December 1-3, 2003, Boston, Massachusetts, U. S. A. /
Materials, integration and packaging issues for high-frequency devices: symposium held December 1-3, 2003, Boston, Massachusetts, U. S. A. /
Book Informaton
Author
Muralt, P.
Series
Materials Research Society symposium proceedings;
Volume
v. 783
Year of Publication
[2004], ©2004.
Publisher
Materials Research Society,
City of Publication
Warrendale, Pa
Pages
232
Language
en
ISBN
1558997210
ARI Id
1675842416540
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