Chapter: Building Networkable Smart and Cooperating Objects

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Home > Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects > Building Networkable Smart and Cooperating Objects

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects |

Kieran Delaney

Springer US

Ambient Intelligence with Microsystems: Augmented Materials and Smart Objects

Building Networkable Smart and Cooperating Objects

Chapter Info

Authors

Kieran Delaney; Ken Murray; Jian Liang

ARI Id

1664087442717_283791

Access

Not Available Free

Pages

363-385

DOI

10.1007/978-0-387-46264-6_17

Chapter URL

https://rd.springer.com/chapter/10.1007/978-0-387-46264-6_17

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Chapters/Headings	Author(s)	Pages	Info
Front Matter		i-xiv
Front Matter		1-2
An Overview of Pervasive Computing Systems	Juan Ye; Simon Dobson; Paddy Nixon	3-17
Augmenting Materials to Build Cooperating Objects	Kieran Delaney; Simon Dobson	19-46
Front Matter		47-48
Overview of Component Level Devices	Erik Jung	49-79
Silicon Technologies for Microsystems, Microsensors and Nanoscale Devices	Thomas Healy	81-99
Front Matter		101-103
Distributed, Embedded Sensor and Actuator Platforms	John Barton; Erik Jung	105-129
Embedded Microelectronic Subsystems	John Barton	131-153
Front Matter		155-156
Embedded Wireless Networking: Principles, Protocols, and Standards	Dirk Pesch; Susan Rea; Andreas Timm-Giel	157-184
Front Matter		185-186
Context in Pervasive Environments	Donna Griffin; Dirk Pesch	187-203
Achieving Co-Operation and Developing Smart Behavior in Collections of Context-Aware Artifacts	Christos Goumopoulos; Achilles Kameas	205-237
Front Matter		239-240
Power Management, Energy Conversion and Energy Scavenging for Smart Systems	Terence O’Donnell; Wensi Wang	241-266
Challenges for Hardware Reliability in Networked Embedded Systems	John Barrett	267-281
Front Matter		283-284
Co-Design: From Electronic Substrates to Smart Objects	Kieran Delaney; Jian Liang	285-296
Chapters/Headings	Author(s)	Pages	Info

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