Chapter: PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers

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Home > Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures > PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers

Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures |

Yuan Xie; Jingsheng Jason Cong; Sachin Sapatnekar

Springer US

Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures

PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers

Chapter Info

Authors

Taeho Kgil; David Roberts; Trevor Mudge

ARI Id

1664458539430_1762750

Access

Not Available Free

Pages

219-260

DOI

10.1007/978-1-4419-0784-4_9

Chapter URL

https://rd.springer.com/chapter/10.1007/978-1-4419-0784-4_9

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Chapters/Headings	Author(s)	Pages	Info
Front Matter		i-xii
Introduction	Kerry Bernstein	1-13
3D Process Technology Considerations	Albert M. Young; Steven J. Koester	15-32
Thermal and Power Delivery Challenges in 3D ICs	Pulkit Jain; Pingqiang Zhou; Chris H. Kim; Sachin S. Sapatnekar	33-61
Thermal-Aware 3D Floorplan	Jason Cong; Yuchun Ma	63-102
Thermal-Aware 3D Placement	Jason Cong; Guojie Luo	103-144
Thermal Via Insertion and Thermally Aware Routing in 3D ICs	Sachin S. Sapatnekar	145-160
Three-Dimensional Microprocessor Design	Gabriel H. Loh	161-188
Three-Dimensional Network-on-Chip Architecture	Yuan Xie; Narayanan Vijaykrishnan; Chita Das	189-217
PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers	Taeho Kgil; David Roberts; Trevor Mudge	219-260
System-Level 3D IC Cost Analysis and Design Exploration	Xiangyu Dong; Yuan Xie	261-280
Back Matter		281-284
Chapters/Headings	Author(s)	Pages	Info

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