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Neural Information Processing: 25th International Conference, ICONIP 2018, Siem Reap, Cambodia, December 13-16, 2018, Proceedings, Part I |
Springer International Publishing
Neural Information Processing: 25th International Conference, ICONIP 2018, Siem Reap, Cambodia, December 13-16, 2018, Proceedings, Part I

Use 3D Convolutional Neural Network to Inspect Solder Ball Defects
Authors

ARI Id

1665157325330_5081900

Access

Not Available Free

Pages

263-274

DOI

10.1007/978-3-030-04167-0_24

Chapter URL

https://rd.springer.com/chapter/10.1007/978-3-030-04167-0_24

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