Home > Neural Information Processing: 25th International Conference, ICONIP 2018, Siem Reap, Cambodia, December 13-16, 2018, Proceedings, Part I > Use 3D Convolutional Neural Network to Inspect Solder Ball Defects
Neural Information Processing: 25th International Conference, ICONIP 2018, Siem Reap, Cambodia, December 13-16, 2018, Proceedings, Part I |
Springer International Publishing
Use 3D Convolutional Neural Network to Inspect Solder Ball Defects
Chapter Info
ARI Id
1665157325330_5081900
Access
Not Available Free
Pages
263-274
DOI
Chapter URL
https://rd.springer.com/chapter/10.1007/978-3-030-04167-0_24
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