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Home > Handbook of Moiré Measurement > Elastic–plastic hole expansion: an experimental and theoretical investigation
Handbook of Moiré Measurement |
C.A. Walker
Routledge
Handbook of Moiré Measurement
Elastic–plastic hole expansion: an experimental and theoretical investigation
Authors

C A Walker; Jim McKelvie; Jim Hyzer

ARI Id

1665896882106_14076293

Access

Not Available Free

Pages

239-249

DOI

10.1201/9781420034219-26

Table of Contents of Book
Showing 1 to 20 of 57 entries
Chapters/HeadingsAuthor(s)PagesInfo
Introduction
C A Walker
1-2
Strain Measurements at the Limit—the Moiré Microscope
3-3
Nonlinear analysis of interferometric moiré fringes
TW Shield
5-17
Microscopic moiré interferometry
Bongtae Han
18-24
Localized thermal strains in electronic interconnections by microscopic moiré interferometry
Bongtae Han
25-33
Titanium in elastic tension: micromechanical deformation
Bongtae Han
34-40
Micromechanical thermal deformation of unidirectional boron/aluminum composite
Bongtae Han
1-2
Fracture Mechanics
49-49
Assessment of the shape of crack-tip plastic zones as a function of applied load
C A Walker; Peter M MacKenzie
51-55
Deformation around fatigue cracks from moiré fringe measurement
Gianni Nicoletto
56-65
Applications of moiré to cellulosic (paper and wood) and concrete materials
R E Rowlands
66-73
Mixed-mode stress intensity factors in finite, edge-cracked orthotropic plates
C A Walker; Jamasri
74-88
A hybrid experimental/computational approach to the assessment of crack growth criteria in composite laminates
C A Walker; M Jam
89-102
Experimental and computational assessment of the T* fracture parameter during creep relaxation
C A Walker; Peter M MacKenzie
103-109
Moiré interferometry and crack closure
Peter M MacKenzie
110-120
Electronic Packaging
121-121
Determination of effective coefficients of thermal expansion (CTE) of electronic packaging components
Yifan Guo
123-133
Determinations of thermal strains in solder joints: an application in electric packaging
Yifan Guo
134-144
Thermomechanical behaviour of two-phase solder column connection under highly accelerated thermal cycle
Bongtae Han
145-152
Verification of numerical models used in microelectronics product development
Bongtae Han
153-159
Chapters/HeadingsAuthor(s)PagesInfo
Showing 1 to 20 of 57 entries
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