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Home > IEMT 2003: 28th Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology (IEMT) Symposium: July 16-18, 2003, the Marriott, San Jose, California, USA / > Reliability Ground Rules Change at <50 [mu]m Pitch
IEMT 2003: 28th Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology (IEMT) Symposium: July 16-18, 2003, the Marriott, San Jose, California, USA / |
IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (28th 2003 San Jose, Calif.)
IEEE,
IEMT 2003: 28th Annual IEEE/CPMT/SEMI International Electronics Manufacturing Technology (IEMT) Symposium: July 16-18, 2003, the Marriott, San Jose, California, USA /
Reliability Ground Rules Change at <50 [mu]m Pitch
Authors

Inderjit Singh

ARI Id

1675552718618_52832512

Access

Not Available Free

Table of Contents of Book
Showing 1 to 20 of 75 entries
Chapters/HeadingsAuthor(s)PagesInfo
Laser Dicing of Chip Scale and Wafer Scale Packages
Todd Lizotte
Unique Fiducial Designs for CSP Singulation Process
Prakom Vijchulata
Precision Flux Deposition Techniques for Semiconductor Applications
Stuart Erickson
An Innovative Underfill Process for High-Speed SMT CSP BGA Flip Chip Assembly
James Jian Zhang
An Acoustic Sensor for Monitoring Microelectronics Packaging Manufacturing Processes
Frances Williams
Study of Non-Solder, Low Cost and High Performance Flip Chip QFN Package Using Ultra Thin Pd PPF
Se Chuel Park
Reliability Ground Rules Change at <50 [mu]m Pitch
Inderjit Singh
The Challenge of Testing Ultra Fine Pitch Wire Bonds
Robert John Sykes
Novel Ultrasonic Transducer Design for Fine-Pitch Wire Bonding
Martin von Arx
Wire Bond Short Reduction by Encapsulation
Hui Wang
In Situ Ball Bond Shear Measurement Using Wire Bonder Bond Head
Johathan Medding
Effect on Leadframe Design on Aluminum Wire Bonding
Tan Joo Hong
Qualification & Optimization of Sn Based Soft Solders: A Refinement for Bi Based Lead Free Soft Solders for EFM Volume Production
Bryan Y. Y. Ong
Implementation of Pb-Free Bumping in Power Packaging
Rajeev Joshi
Lead-Free Package Interconnections for Ceramic Grid Arrays
Marie S. Cole
Investigation of a Lead-Free Flip Chip Assembly Process
Gerard Kums
Inter-Dependence of Processing and Alloy Composition on the Reliability of Sn-Based Lead-Free Solders in Fine Pitch FCOB Interconnection
Changqing Liu
Towards a Halogen-Free Package - GREEN Molding Compound
Joanne B. N. Kee
A Methodology for the Generation of Dynamic Compact Models of Packages and Heat Sinks from Thermal Transient Measurements
Maria Rencz
A Comparison of Electrical Performances Between a Wire Bonded and a Flip Chip CSP Package
Rahul Kapoor
Chapters/HeadingsAuthor(s)PagesInfo
Showing 1 to 20 of 75 entries
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