Chapter: 1. Introduction

Click here to donate your five minutes and submit the table of contents of a book.

Search from the table of contents of 2.5 million books

Advanced Search (Beta)

Home > Handbook of multilevel metallization for integrated circuits: materials, technology, and applications / > 1. Introduction

Handbook of multilevel metallization for integrated circuits: materials, technology, and applications / |

Wilson, Syd R.; Tracy, Clarence J.; Freeman, John L.

Noyes,

Handbook of multilevel metallization for integrated circuits: materials, technology, and applications /

1. Introduction

Chapter Info

Authors

Syd R. Wilson, Clarence J. Tracy and John L. Freeman, Jr.

ARI Id

1675893411676_53799869

Access

Not Available Free

Chapters

entries per page

Filter:

Showing 0 to 0 of 0 entries

Chapter	Author(s)	Book	Book Authors	Year	Publisher
No data available in table
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 0 to 0 of 0 entries

Books

entries per page

Filter:

Showing 0 to 0 of 0 entries

Book	Author(s)	Year	Publisher
No data available in table
Book	Author(s)	Year	Publisher

Showing 0 to 0 of 0 entries

Books

Book	Author(s)	Year	Publisher
Book	Author(s)	Year	Publisher

Articles

entries per page

Filter:

Showing 0 to 0 of 0 entries

Article Title	Authors	Journal	Vol Info	Language
No data available in table
Article Title	Authors	Journal	Vol Info	Language

Showing 0 to 0 of 0 entries

Articles

entries per page

Filter:

Showing 0 to 0 of 0 entries

Heading	Article Title	Authors	Journal	Vol Info
No data available in table
Heading	Article Title	Authors	Journal	Vol Info

Showing 0 to 0 of 0 entries

Articles

entries per page

Filter:

Showing 0 to 0 of 0 entries

Title	Author	Supervisor	Degree	Institute
No data available in table
Title	Author	Supervisor	Degree	Institute

Showing 0 to 0 of 0 entries

Table of Contents of Book

entries per page

Filter:

Showing 1 to 12 of 12 entries

Chapters/Headings	Author(s)	Pages	Info
1. Introduction	Syd R. Wilson, Clarence J. Tracy and John L. Freeman, Jr.
2. Silicides and Contacts for ULSI	George E. Georgiou
3. Aluminum Based Multilevel Metallizations in VLSI/ULSICs	K. Ramkumar, Sumanta K. Ghosh and Arjun N. Saxena
4. Inorganic Dielectrics	Chiu H. Ting
5. Organic Dielectrics in Multilevel Metallization of Integrated Circuits	Krishna Seshan, Dominic J. Schepis and Laura B. Rothman
6. Planarization Techniques	Jeff Olsen and Farhad Moghadam
7. Lithography and Etch Issues for a Multilevel Metallization System	Gregory W. Grynkewich and John N. Helbert
8. Electro- and Stress-Migration in MLM Interconnect Structures	Michael L. Dreyer and Paul S. Ho
9. Multilevel Metallization Test Vehicle	Syd R. Wilson, Charles J. Varker and John L. Freeman, Jr.
10. Manufacturing and Analytic Methods	Thomas Seidel
11. Characterization Techniques for VLSI Multilevel Metallization	Simon Thomas.12. Electronic Packaging and Its Influences On Integrated Circuit Design and Processing / Harry K. Charles, Jr. and G. Donald Wagner
13. Future Interconnect Systems	S. Simon Wong.
Chapters/Headings	Author(s)	Pages	Info

Showing 1 to 12 of 12 entries

Similar Books

entries per page

Filter:

Showing 0 to 0 of 0 entries

Book	Author(s)	Year	Publisher
No data available in table
Book	Author(s)	Year	Publisher

Showing 0 to 0 of 0 entries

Similar Chapters

entries per page

Filter:

Showing 0 to 0 of 0 entries

Chapter	Author(s)	Book	Book Authors	Year	Publisher
No data available in table
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 0 to 0 of 0 entries

Similar Thesis

entries per page

Filter:

Showing 0 to 0 of 0 entries

Title	Author	Supervisor	Degree	Institute
No data available in table
Title	Author	Supervisor	Degree	Institute

Showing 0 to 0 of 0 entries

Similar News

entries per page

Filter:

Showing 0 to 0 of 0 entries

Headline	Date	News Paper	Country
No data available in table
Headline	Date	News Paper	Country

Showing 0 to 0 of 0 entries