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> Koen De Munck, Jan Vaes, Lieve Bogaerts, Piet De Moor, Chris Van Hoof and Bart Swinnen
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Grinding and mixed silicon copper CMP of stacked patterned wafers for 3-D integration
Koen De Munck, Jan Vaes, Lieve Bogaerts, Piet De Moor, Chris Van Hoof and Bart Swinnen
Enabling technologies for 3-D integration: symposium held November 27-29, 2006, Boston, Massachusetts, U. S. A. /
Bower, Christopher Andrew.
c2007.
Materials Research Society,
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