"Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs"

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Book	Author(s)	Year	Publisher
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs	Brandon Noia; Krishnendu Chakrabarty	2014	Springer International Publishing
Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures	Kanchan Manna; Jimson Mathew	1st ed. 2020	Springer International Publishing
Geometry and optimization techniques for structural design /	Kodiyalam, S.; Saxena, M.	[1994], ©1994.	Elsevier Applied Science,
Arithmetic Optimization Techniques for Hardware and Software Design	Ryan Kastner; Anup Hosangadi; Farzan Fallah	2010-05	Cambridge University Press
Simulation-Based Optimization: Parametric Optimization Techniques and Reinforcement Learning	Abhijit Gosavi	2003	Springer US
Simulation-Based Optimization: Parametric Optimization Techniques and Reinforcement Learning	Abhijit Gosavi	2nd ed. 2015	Springer US
Mechanical Design Optimization Using Advanced Optimization Techniques	R. Venkata Rao; Vimal J. Savsani	2012	Springer London
Advanced Techniques for Embedded Systems Design and Test	Juan C. López; Román Hermida; Walter Geisselhardt	1998	Springer US
CTL for Test Information of Digital ICs	Rohit Kapur	2002	Springer US
Micro-Electrode-Dot-Array Digital Microfluidic Biochips: Design Automation, Optimization, and Test Techniques	Zipeng Li; Krishnendu Chakrabarty; Tsung-Yi Ho; Chen-Yi Lee	1st ed. 2019	Springer International Publishing
3D Rotations: Parameter Computation and Lie Algebra-based Optimization	Kenichi Kanatani	2020	Routledge
Surrogate Model-Based Engineering Design and Optimization	Ping Jiang; Qi Zhou; Xinyu Shao	1st ed. 2020	Springer Nature Singapore
Optimization Methods for Material Design of Cement-Based Composites	A.M. Brandt	1998	Routledge
Design Automation Techniques for Approximation Circuits: Verification, Synthesis and Test	Arun Chandrasekharan; Daniel Große; Rolf Drechsler	1st ed. 2019	Springer International Publishing
Research on Ship Design and Optimization Based on Simulation-Based Design (SBD) Technique	Bao-Ji Zhang; Sheng-Long Zhang	1st ed. 2019	Springer Nature Singapore
Transformer-Based Design Techniques for Oscillators and Frequency Dividers	Howard Cam Luong; Jun Yin	1st ed. 2016	Springer International Publishing
OFDM-based Broadband Wireless Networks: Design and Optimization	Hui Liu	2005	John Wiley & Sons
Antenna Optimization and Design Based on Binary Coding	Junping Geng; Ronghong Jin	1st ed. 2022	Springer Nature Singapore
OFDM-based broadband wireless networks: design and optimization /	Liu, Hui,; Li, Guoqing,	[2005], ©2005.	Wiley-Interscience,
Testability Concepts for Digital ICs: The Macro Test Approach	F. P. M. Beenker; R. G. Bennetts; A. P. Thijssen	1995	Springer US
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Chapter	Author(s)	Book	Book Authors	Year	Publisher
Physical Design Flow for 3D/CoWoS® Stacked ICs	Yu-Shiang Lin; Sandeep K. Goel; Jonathan Yuan; Tom Chen; Frank Lee	Handbook of 3D Integration - Vol. 4 - Design, Test, and Thermal Management	Muhannad S. Bakir; Paul D. Franzon; Erik Jan Marinissen	2019	John Wiley & Sons
Repairing TSVs for 3D ICs Using Redundant TSV	Sudeep Ghosh; Mandira Banik; Tridib Chakraborty; Chowdhury Md. Mizan; Trishita Ghosh; Soumyadipta Basu	Proceedings of International Conference on Industrial Instrumentation and Control: ICI2C 2021	Subhasis Bhaumik; Subrata Chattopadhyay; Tanushyam Chattopadhyay; Srijan Bhattacharya	1st ed. 2022	Springer Nature Singapore
Design Methodology for TSV-Based 3D Clock Networks	Taewhan Kim; Heechun Park	Physical Design for 3D Integrated Circuits	Aida Todri-Sanial; Chuan Seng Tan	2016	Routledge
Optimization of Test-Access Architectures and Test Scheduling for 3D ICs	Sergej Deutsch; Brandon Noia; Krishnendu Chakrabarty; Erik Jan Marinissen	Handbook of 3D Integration - Vol. 4 - Design, Test, and Thermal Management	Muhannad S. Bakir; Paul D. Franzon; Erik Jan Marinissen	2019	John Wiley & Sons
TSV-Based 3D Integration	James Burns	Three Dimensional System Integration: IC Stacking Process and Design	Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic	2011	Springer US
Physical Design for 3D ICs	Sung-Kyu Lim	Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology	Luciano Lavagno; Igor L. Markov; Grant Martin; Louis K. Scheffer	2016	Routledge
Cost Modeling for 2. 5D and 3D Stacked ICs	Mottaqiallah Taouil; Said Hamdioui; Erik Jan Marinissen	Handbook of 3D Integration - Vol. 4 - Design, Test, and Thermal Management	Muhannad S. Bakir; Paul D. Franzon; Erik Jan Marinissen	2019	John Wiley & Sons
Thermal Modeling and Model Validation for 3D Stacked ICs	Herman Oprins; Federica Maggioni; Vladimir Cherman; Geert Van der Plas; Eric Beyne	Handbook of 3D Integration - Vol. 4 - Design, Test, and Thermal Management	Muhannad S. Bakir; Paul D. Franzon; Erik Jan Marinissen	2019	John Wiley & Sons
Optimization of Test Wrapper Length for TSV Based 3D SOCs Using a Heuristic Approach	Tanusree Kaibartta; Debesh Kumar Das	VLSI Design and Test: 22nd International Symposium, VDAT 2018, Madurai, India, June 28-30, 2018, Revised Selected Papers	S. Rajaram; N.B. Balamurugan; D. Gracia Nirmala Rani; Virendra Singh	1st ed. 2019	Springer Nature Singapore
Clustered Fault Repairing Architecture for 3D ICs Using Redundant TSV	Sudeep Ghosh; Mandira Banik; Moumita Das; Tridib Chakraborty; Chowdhury Md. Mizan; Arkajyoti Chakraborty	Proceedings of International Conference on Innovations in Software Architecture and Computational Systems: ISACS 2021	Jyotsna Kumar Mandal; Somnath Mukhopadhyay; Aynur Unal; Santanu Kumar Sen	1st ed. 2021	Springer Nature Singapore
Chapter 2 - Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design	Bing Shi; Ankur Srivastava	Green and Sustainable Computing: Part II	Ali Hurson	2013	Elsevier
Mechanical Reliability Analysis and Optimization for 3D ICs	Sung Kyu Lim	Design for High Performance, Low Power, and Reliable 3D Integrated Circuits	Sung Kyu Lim	2012	Springer New York
Design, verification, and optimization of novel 3D RF TSV based on HR-Si interposer	Shenglin Ma; Yufeng Jin	TSV 3D RF Integration	Shenglin Ma; Yufeng Jin	2022	Elsevier
Testing 3D Stacked ICs Containing Through-Silicon Vias	Erik Jan Marinissen	3D Integration for NoC-based SoC Architectures	Abbas Sheibanyrad; Frédéric Pétrot; Axel Jantsch	2011	Springer New York
Design Challenges and Solutions for Monolithic 3D ICs	Sung Kyu Lim; Yiyu Shi	Physical Design for 3D Integrated Circuits	Aida Todri-Sanial; Chuan Seng Tan	2016	Routledge
Computer Based Optimization Techniques for HDSL Design	Syed V. Ahamed; Victor B. Lawrence	Design and Engineering of Intelligent Communication Systems	Syed V. Ahamed; Victor B. Lawrence	1997	Springer US
TSV-to-TSV Coupling Analysis and Optimization	Sung Kyu Lim	Design for High Performance, Low Power, and Reliable 3D Integrated Circuits	Sung Kyu Lim	2012	Springer New York
TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications, and TSV-Based Bandpass Filter	Khaled Salah; Yehea Ismail; Alaa El-Rouby	Arbitrary Modeling of TSVs for 3D Integrated Circuits	Khaled Salah; Yehea Ismail; Alaa El-Rouby	2015	Springer International Publishing
3D Design-for-Test Architecture	Erik Jan Marinissen; Mario Konijnenburg; Jouke Verbree; Chun-Chuan Chi; Sergej Deutsch; Christos Papameletis; Tobias Burgherr; Konstantin Shibin; Brion Keller; Vivek Chickermane; Sandeep K. Goel	Handbook of 3D Integration - Vol. 4 - Design, Test, and Thermal Management	Muhannad S. Bakir; Paul D. Franzon; Erik Jan Marinissen	2019	John Wiley & Sons
Physical Design Techniques for Three-Dimensional ICs	Vasilis F. Pavlidis; Ioannis Savidis; Eby G. Friedman	Three-Dimensional Integrated Circuit Design (Second Edition)	Vasilis F. Pavlidis; Ioannis Savidis and Eby G. Friedman	2017	Morgan Kaufmann
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Showing 1 to 20 of 100 entries

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