"Development of 3D Chip Integration Technology"

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Book	Author(s)	Year	Publisher
Handbook of 3D Integration Volume 3 - 3D Process Technology	Philip Garrou; Mitsumasa Koyanagi; Peter Ramm	2014	John Wiley & Sons
Handbook of 3D Integration - Technology and Applications of 3D Integrated Circuits	Philip Garrou; Christopher Bower; Peter Ramm	2008	John Wiley & Sons
Integration of Science and Technology with Development	D. Babatunde Thomas and Miguel S. Wionczek	1979	Pergamon
Chip Technology	Jörg Hoheisel	2002	Springer Berlin Heidelberg
TSV 3D RF Integration	Shenglin Ma; Yufeng Jin	2022	Elsevier
Information technology integration for socio-economic development /	Tossy, Titus,		IGI Global
3D and Circuit Integration of MEMS	Masayoshi Esashi	2021	John Wiley & Sons
3D Integration for VLSI Systems	Chuan Seng Tan; Kuan-Neng Chen; Steven J. Koester	2011	Routledge
Large-scale 3D data integration /	Zlatanova, Siyka.; Prosperi, David.	2006.	Taylor & Francis,
Network-on-Chip: The Next Generation of System-on-Chip Integration	Santanu Kundu; Santanu Chattopadhyay	2015	Routledge
3D Concrete Printing Technology	Ali Nazari; Behzad Nematollahi and Jay Sanjayan	2019	Butterworth-Heinemann
Mobile 3D Graphics SoC: From Algorithm to Chip	Hoi-Jun Yoo; Jeong-Ho Woo; Ju-Ho Sohn; Byeong-Gyu Nam	2010	Wiley-IEEE Press
Designing 2D and 3D Network-on-Chip Architectures	Konstantinos Tatas; Kostas Siozios; Dimitrios Soudris; Axel Jantsch	2014	Springer New York
Multi-Material 3D Printing Technology	Feng Zhang; Gang Zhang; Jianping Shi; Jiquan Yang; Li Na and Wenlai Tang	2021	Academic Press
3D Printing Technology in Nanomedicine	Nabeel Ahmad; P. Gopinath andRajiv Dutta	2019	Elsevier
3D Integration for NoC-based SoC Architectures	Abbas Sheibanyrad; Frédéric Pétrot; Axel Jantsch	2011	Springer New York
Integration technology for CASE /	Daley, Richard.	[1993], ©1993.	Avebury Technical,
Networking Technology & Service Integration		2005	Pearson Custom Publishing
3D Game Programming All in One (Course Technology PTR Game Development Series)	Kenneth C Finney	2004	Course Technology PTR
Ultra-thin Chip Technology and Applications	Joachim Burghartz	2011	Springer New York
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Showing 1 to 20 of 100 entries

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Chapter	Author(s)	Book	Book Authors	Year	Publisher
Development of 3D Chip Integration Technology	Krzysztof Iniewski	Nano-Semiconductors: Devices and Technology	Krzysztof Iniewski	2012	Routledge
3D Integration Technology	Yuan Xie; Qiaosha Zou	More than Moore Technologies for Next Generation Computer Design	Rasit O. Topaloglu	2015	Springer New York
3D Integration Technology	Yuan Xie; Jishen Zhao	Die-stacking Architecture	Yuan Xie; Jishen Zhao		Springer International Publishing
3D Integration Technology for Multicore Systems On-Chip	Abderazek Ben Abdallah	Advanced Multicore Systems-On-Chip: Architecture, On-Chip Network, Design	Abderazek Ben Abdallah	1st ed. 2017	Springer Nature Singapore
1022 Chip-level 3D integration		MEMS Resonator Filters	Rajendra M. Patrikar	2020	Institution of Engineering and Technology
Overview of 3D Integration Process Technology	Philip Garrou; Christopher Bower	Handbook of 3D Integration - Technology and Applications of 3D Integrated Circuits	Philip Garrou; Christopher Bower; Peter Ramm	2008	John Wiley & Sons
3D Multi-chip Integration and Packaging Technology for NAND Flash Memories	Herb Huang; Rino Micheloni	3D Flash Memories	Rino Micheloni	1st ed. 2016	Springer Netherlands
Chip Integration	James Donald Rockrohr	High Speed Serdes Devices and Applications	David Robert Stauffer; Jeanne Trinko Mechler; Michael A. Sorna; Kent Dramstad; Clarence Rosser Ogilvie; Amanullah Mohammad; James Donald Rockrohr	2009	Springer US
Chip Integration	Geraldine Cogin Schwartz and K.V. Srikrishnan	Handbook of Semiconductor Interconnection Technology	Geraldine Cogin Shwartz; Geraldine C. Schwartz; Kris V. Srikrishnan	2006	Routledge
Technology development and integration		Nature		2020
Integration of Electrospinning and 3D Printing Technology	Zhaoxu Zhang; Wei Zhang; Xiaoli Peng; Xindan Zhang; Yunpeng Wang; Bing Yu et al.	Electrospun Nanofibers: Principles, Technology and Novel Applications	Ashok Vaseashta; Nimet Bölgen	1st ed. 2022	Springer International Publishing
Development of 3D GIS Modeling Technology	Xiangjian Meng; Gang Liu	Computer and Computing Technologies in Agriculture, Volume II: First IFIP TC 12 International Conference on Computer and Computing Technologies in Agriculture (CCTA 2007), Wuyishan, China, August 18-20, 2007	Daoliang Li	2008	Springer US
Microprocessor Design Using 3D Integration Technology	Yuan Xie	Three Dimensional System Integration: IC Stacking Process and Design	Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic	2011	Springer US
Flip-Chip Integration	Yikun Yu; Peter G. M. Baltus; Arthur H. M. van Roermund	Integrated 60GHz RF Beamforming in CMOS	Yikun Yu; Peter G.M. Baltus; Arthur H.M. van Roermund	2011	Springer Netherlands
VI. Chip Integration	Geraldine Cogin Schwartz and K. V. Srikrishnan	Handbook of semiconductor interconnection technology /	Schwartz, G. C.; Srikrishnan, K. V.,; Bross, Arthur,	[1998], ©1998.	Marcel Dekker,
3D Integration		Interconnect Noise Optimization in Nanometer Technologies	Mohamed Elgamel; Magdy A. Bayoumi	2006	Springer US
3D Integration	John H. Lau	Fan-Out Wafer-Level Packaging	John H. Lau	1st ed. 2018	Springer Nature Singapore
Heterogeneous Integration of Chip-to-Chip Stacks	John H. Lau	Heterogeneous Integrations	John H. Lau	1st ed. 2019	Springer Nature Singapore
Gene Chip Technology		Encyclopedic Reference of Genomics and Proteomics in Molecular Medicine	Detlev Ganten; Klaus Ruckpaul	2006	Springer Berlin Heidelberg
Three-chip Technology	Paul Wheeler	High Definition Cinematography	Paul Wheeler	2009	Routledge
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 1 to 20 of 100 entries

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