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"Fundamentals of Cu/barrier-layer adhesion in microelectronic processing" - similar Books and Chapters
Showing 1 to 20 of 100 entries
Book | Author(s) | Year | Publisher |
1991 | Springer US | ||
1995 | De Gruyter | ||
1999 | Gordon and Breach Science Publishers | ||
1st ed. 2018 | Springer International Publishing | ||
1995 | Routledge | ||
1st ed. 2017 | Springer International Publishing | ||
1981 | South-Western Pub. Co. | ||
[2003], ©2003. | Prentice Hall, | ||
2016 | Springer International Publishing | ||
1st ed. 2013 | Springer International Publishing | ||
1996 | Wiley-IEEE Press | ||
1995 | Springer Netherlands | ||
2015 | Springer International Publishing | ||
2015 | Springer Berlin Heidelberg | ||
2nd ed. 2019 | Springer International Publishing | ||
1998 | Academic Press | ||
©2006. | CRC Press, | ||
©2011. | CRC Press, | ||
2006 | CRC Press | ||
2014 | McGraw-Hill Education | ||
Boook | Author(s) | Year | Publisher |
Showing 1 to 20 of 100 entries
Chapter | Author(s) | Book | Book Authors | Year | Publisher |
c2005. | Materials Research Society, | ||||
3rd ed. 1990 | Springer US | ||||
1968 | Highway Research Board, National Research Council | ||||
2019 | John Wiley & Sons | ||||
2013 | John Wiley & Sons | ||||
1999 | Wiley-IEEE Press | ||||
[1998], ©1998. | Materials Research Society, | ||||
2021 | |||||
2019 | |||||
©1969 | |||||
2022 | Routledge | ||||
2017 | Routledge | ||||
1998 | William Andrew Publishing | ||||
2nd ed. 2020 | Springer International Publishing | ||||
0th ed. 2020 | Springer International Publishing | ||||
2002 | Sams | ||||
2001 | Springer Netherlands | ||||
2015 | Springer New York | ||||
0th ed. 2020 | Springer New York | ||||
2022 | Routledge | ||||
Chapter | Author(s) | Book | Book Authors | Year | Publisher |