"Interconnect Architectures for 3D Technologies"

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Book	Author(s)	Year	Publisher
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization	Lennart Bamberg; Jan Moritz Joseph; Alberto García-Ortiz; Thilo Pionteck	1st ed. 2022	Springer International Publishing
Integrated Optical Interconnect Architectures for Embedded Systems	Ian O'Connor; Gabriela Nicolescu	2012	Springer New York
Cache and Interconnect Architectures in Multiprocessors	Michel Dubois; Shreekant S. Thakkar	1990	Springer US
Three-Dimensional Molded Interconnect Devices (3D-MID)	Jörg Franke	2013	Hanser
Interconnect Noise Optimization in Nanometer Technologies	Mohamed Elgamel; Magdy A. Bayoumi	2006	Springer US
3D Integration for NoC-based SoC Architectures	Abbas Sheibanyrad; Frédéric Pétrot; Axel Jantsch	2011	Springer New York
Novel 3D Media Technologies	Ahmet Kondoz; Tasos Dagiuklas	2015	Springer New York
Vertical 3D Memory Technologies	Betty Prince	2014	John Wiley & Sons
Campus Network Architectures and Technologies	Ningguo Shen; Changqing Yang; Bin Yu; Mingxiang Huang; Hailin Xu	2021	Routledge
3D Microelectronic Packaging: From Architectures to Applications	Yan Li; Deepak Goyal	2nd ed. 2021	Springer Nature Singapore
3D Imaging Technologies in Atherosclerosis	Rikin Trivedi; Luca Saba; Jasjit S. Suri	1st ed. 2015	Springer US
Visioning Technologies: The Architectures of Sight	Graham Cairns	2016	Routledge
3D Video Coding for Embedded Devices: Energy Efficient Algorithms and Architectures	Bruno Zatt; Muhammad Shafique; Sergio Bampi; Jörg Henkel	2013	Springer New York
Designing 2D and 3D Network-on-Chip Architectures	Konstantinos Tatas; Kostas Siozios; Dimitrios Soudris; Axel Jantsch	2014	Springer New York
Wireless Interface Technologies for 3D IC and Module Integration	Tadahiro Kuroda; Wai-Yeung Yip	2021-09	Cambridge University Press
Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures	Kanchan Manna; Jimson Mathew	1st ed. 2020	Springer International Publishing
3D Printing and Additive Manufacturing Technologies	L. Jyothish Kumar; Pulak M. Pandey; David Ian Wimpenny	1st ed. 2019	Springer Nature Singapore
Enabling eBusiness - Integrating Technologies, Architectures and Applications	W.S. Whyte	2001	John Wiley & Sons
Elastic Optical Networks: Architectures, Technologies, and Control	Víctor López; Luis Velasco	1st ed. 2016	Springer International Publishing
Intelligent Integrated Systems: Devices, Technologies, and Architectures	Simon Deleonibus	2013	Routledge
Boook	Author(s)	Year	Publisher

Showing 1 to 20 of 100 entries

entries per page

Filter:

Showing 1 to 20 of 100 entries

Chapter	Author(s)	Book	Book Authors	Year	Publisher
Interconnect Architectures for 3D Technologies	Lennart Bamberg; Jan Moritz Joseph; Alberto García-Ortiz; Thilo Pionteck	3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization	Lennart Bamberg; Jan Moritz Joseph; Alberto García-Ortiz; Thilo Pionteck	1st ed. 2022	Springer International Publishing
Emerging Interconnect Technologies for 3D Networks-on-Chip	Sharma Rohit; Kiyoung Choi	Design of 3D Integrated Circuits and Systems	Rohit Sharma; Krzysztof Iniewski	2015	Routledge
Interconnect Technologies	T. C. Edwards; M. B. Steer	Foundations of Interconnect and Microstrip Design3e	T. C. Edwards	2000	John Wiley & Sons
3D Interconnect Simulation	Simon Li; Yue Fu	3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics	Simon Li; Suihua Li	2012	Springer New York
3D Interconnect Extraction	Sung Kyu Lim	Physical Design for 3D Integrated Circuits	Aida Todri-Sanial; Chuan Seng Tan	2016	Routledge
3D Interconnect Technology	John U. Knickerbocker; Lay Wai Kong; Sven Niese; Alain Diebold; Ehrenfried Zschech	Advanced Interconnects for ULSI Technology	Mikhail Baklanov; P. S. Ho; Ehrenfried Zschech	2012	John Wiley & Sons
Advanced Interconnect Technologies	ROBERT G. McKENNA; THOMAS M. MOORE	Characterization of Integrated Circuit Packaging Materials	Thomas Moore	1993	Newnes
Advanced Interconnect Technologies	Christina (Tanya) Politi; Dimitris Alexandropoulos; Dimitra Simeonidou	Optical Network Design and Modeling: 23rd IFIP WG 6. 10 International Conference, ONDM 2019, Athens, Greece, May 13–16, 2019, Proceedings	Anna Tzanakaki; Manos Varvarigos; Raul Muñoz; Reza Nejabati; Noboru Yoshikane; Markos Anastasopoulos; Johann Marquez-Barja	1st ed. 2020	Springer International Publishing
Planar Interconnect Technologies		Foundations for Microstrip Circuit Design	Terry C. Edwards; Michael B. Steer	2016	Wiley-IEEE Press
Interconnect-Centric Computer Architectures	S. M. Chai; D. Scott Wills	Interconnect Technology and Design for Gigascale Integration	Jeffrey A. Davis; James D. Meindl	2003	Springer US
3D Architectures	Walid Lafi; Didier Lattard	Design Technology for Heterogeneous Embedded Systems	Gabriela Nicolescu; Ian O'Connor; Christian Piguet	2012	Springer Netherlands
Technologies for Scalable Architectures		Enterprise Web 2. 0 fundamentals	Sankar, Krishna; Bouchard, Susan A; Bouchard, Susan; Mancini, Dennis	2009	Cisco Press
Interconnect synthesis for reconfigurable multi-FPGA architectures	Vinoo Srinivasan; Shankar Radhakrishnan; Ranga Vemuri; Jeff Walrath	Parallel and Distributed Processing: 11th IPPS/SPDP’99 Workshops Held in Conjunction with the 13th International Parallel Processing Symposium and 10th Symposium on Parallel and Distributed Processing San Juan, Puerto Rico, USA, April 12–16, 1999 Proceedings	José Rolim; Frank Mueller; Albert Y. Zomaya; Fikret Ercal; Stephan Olariu; Binoy Ravindran; Jan Gustafsson;	1999	Springer Berlin Heidelberg
Emerging SAN Interconnect Technologies		Storage Area Networking Essentials: A Complete Guide to Understanding & Implementing SANs	Richard Barker, Paul Massiglia	2001	Wiley
3. Interconnect Substrate Technologies	Iwona Turlik	Physical architecture of VLSI systems /	Hannemann, Rob,; Kraus, Allan D.; Pecht, Michael.	[1994], ©1994.	Wiley,
Circuit Architectures for 3D Integration	Nisha Checka	Wafer Level 3-D ICs Process Technology	Chuan Seng Tan; Ronald J. Gutmann; L. Rafael Reif	2009	Springer US
Technologies for Service-Oriented Architectures		Designing Mobile Service Systems - Volume 2 Research in Design Series	E.A.M. Van De Kar, A. Verbraeck	2008-01-01	IOS Press
Graphene 3D Architectures	Ling Bing Kong; Freddy Boey; Huang Yizhong; Jason Zhichuan Xu; Zhou Kun; Sean Li; Wenxiu Que; Hui Huang; Tianshu Zhang	Carbon Nanomaterials Based on Graphene Nanosheets	Ling Bing Kong	2017	Routledge
Architectures and Technologies	Anura Gurugé	Corporate Portals Empowered with XML and Web Services	Anura Gurugé	2002	Digital Press
1 Optical Interconnect Technologies for Datacenter Networks		Datacenter Connectivity Technologies: Principles and Practice	Frank Chang	2017	River Publishers
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 1 to 20 of 100 entries

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