"Samsung Elec expects $100 mln or more sales from advanced chip packaging business"

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Book	Author(s)	Year	Publisher
Advanced Flip Chip Packaging	Ho-Ming Tong; Yi-Shao Lai; C.P. Wong	2013	Springer US
Advanced Electronic Packaging	Richard K. Ulrich; William D. Brown	2006	Wiley-IEEE Press
Semiconductor Advanced Packaging	John H. Lau	1st ed. 2021	Springer Nature Singapore
Advanced electronic packaging.	Brown, William D.,; Ulrich, Richard K.	c2006.	IEEE,
Materials for Advanced Packaging	Daniel Lu; C.P. Wong	2009	Springer US
Materials for Advanced Packaging	Daniel Lu; C.P. Wong	2nd ed. 2017	Springer International Publishing
Advanced MEMS Packaging (Electronic Engineering)	John Lau, Cheng Lee, C. Premachandran, Yu Aibin	2009	McGraw-Hill Education
Velocities of change: critical essays from MLN.	Richard Macksey	1974	Johns Hopkins University Press
England expects	Sara Sheridan	2014	Polygon;Polygon An Imprint of Birlinn Limited
England Expects	James Corbett	April 25, 2006	Aurum Press Ltd
Evolution Expects	Jonathan Green	2009	Abaddon Books
England Expects	Hart Rw	February 1973	Putnam Pub Group
Samsung Galaxy Note 4: the 100% unofficial user guide	Aaron J. Halbert	2015	[publisher not identified]
Advanced Multicore Systems-On-Chip: Architecture, On-Chip Network, Design	Abderazek Ben Abdallah	1st ed. 2017	Springer Nature Singapore
Samsung: galaxy	Donald Clifford Gallup	1998	Beinecke Rare Book & Manuscript Library, Yale University
Bio-based Materials for Food Packaging: Green and Sustainable Advanced Packaging Materials	Shakeel Ahmed	1st ed. 2018	Springer Nature Singapore
Advanced Graphic Communications, Packaging Technology and Materials	Yun Ouyang; Min Xu; Li Yang; Yujie Ouyang	1st ed. 2016	Springer Nature Singapore
Food Packaging: Advanced Materials, Technologies, and Innovations	Sanjay Mavinkere Rangappa; Jyotishkumar Parameswaranpillai; Senthil Muthu Kumar Thiagamani; Senthilkumar Krishnasamy; Suchart Siengchin	2020	Routledge
Advanced Printing and Packaging Materials and Technologies	Ouyang, Yun	2015	Trans Tech Publishers
Advanced Business	Jon Sutherland	October 19, 1995	Hodder Arnold H&S
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Chapter	Author(s)	Book	Book Authors	Year	Publisher
Chip Packaging	Andrew H. Eschenfelder	Magnetic Bubble Technology	A. H. Eschenfelder	2nd ed. 1981	Springer Berlin Heidelberg
Chip Packaging	Andrew H. Eschenfelder	Magnetic Bubble Technology	A. H. Eschenfelder	1980	Springer Berlin Heidelberg
Chip packaging	Xiaobing Luo; Run Hu	Nitride Semiconductor Light-Emitting Diodes (LEDs) (Second Edition)	Jian-Jang Huang; Hao-Chung Kuo and Shyh-Chiang Shen	2018	Woodhead Publishing
Chip Scale Packaging		The Hardware Hacking Handbook: Breaking Embedded Security with Hardware Attacks	Jasper van Woudenberg, Colin O'Flynn	2021	No Starch Press
Chip Scale Packaging		The Hardware Hacking Handbook. Breaking Embedded Security With Hardware Attacks	Jasper van Woudenberg, Colin O’Flynn	2022	No Starch Press
Embedded Chip Packaging	John H. Lau	Fan-Out Wafer-Level Packaging	John H. Lau	1st ed. 2018	Springer Nature Singapore
Alternative Chip Packaging		Electronic Technology Handbook	Neil Sclater	1999	McGraw Hill Professional
Advanced packaging		Guide for Debian maintainers	Osama Aoki	2015
Advanced Packaging	John H. Lau	Semiconductor Advanced Packaging	John H. Lau	1st ed. 2021	Springer Nature Singapore
100 Samsung: the rising brand		Brand Royalty: How the Worlds Top 100 Brands Thrive & Survive	Matt Haig	2004	Kogan Page
Advanced sales		Themis bar review: New York	Themis Bar Review, LLC	2015	Themis Bar Review, LLC
Packaging the IC—Single Chip Packaging		Integrated Circuit Packaging, Assembly and Interconnections	William Greig	2007	Springer US
More or fewer than 100?		What is a hundred?	Danielle Carroll	2005	Red Brick Learning
People Expect More from Packaging		Food & Beverage Packaging November - December 2011	Rick Lingle		Business News Publishing Co.
ELEC		Encyclopaedia Britannica	Encyclopaedia Britannica	1922	Encyclopaedia Britannica, Inc.
ELEC		Encyclopaedia Britannica	Encyclopaedia Britannica	1926	Encyclopaedia Britannica, Inc.
Elec.		The calender of Scripture VVhearin the Hebru, Challdian, Arabian, Phenician, Syrian, Persian, Greek and Latin names, of nations, cuntreys, men, weemen, idols, cities, hils, riuers, [and] of oother places in the holly Byble mentioned, by order of letters ar set, and turned into oour English toong. 1575.	Patten, William, fl. 1548-1580.	1575	Printed by Richard Jugge
22 SINGLE-CHIP PACKAGING		Coombs' Printed Circuits Handbook	Clyde F. Coombs	2001	McGraw-Hill Professional
Advanced Packaging Techniques	Clive Max Maxfield	Bebop to the Boolean Boogie (Third Edition)	Clive Max Maxfield	2009	Newnes
Advanced Packaging Trends	John H. Lau	Semiconductor Advanced Packaging	John H. Lau	1st ed. 2021	Springer Nature Singapore
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 1 to 20 of 100 entries

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