"Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging"

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Book	Author(s)	Year	Publisher
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging	Jong-Hoon Lee; Manos Tentzeris		Springer International Publishing
Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging	Jong-Hoon Lee	2008	Morgan and Claypool Publishers
Wireless Communications for Power Substations: RF Characterization and Modeling	Basile L. Agba; Fabien Sacuto; Minh Au; Fabrice Labeau; François Gagnon	1st ed. 2019	Springer International Publishing
RF and Microwave Microelectronics Packaging	Ken Kuang; Franklin Kim; Sean S. Cahill	2010	Springer US
EM Modeling of Antennas and RF Components for Wireless Communication Systems	Frank Gustrau; Dirk Manteuffel	2006	Springer Berlin Heidelberg
RF and Microwave Microelectronics Packaging II	Ken Kuang; Rick Sturdivant	1st ed. 2017	Springer International Publishing
RF and Microwave Wireless Systems	Kai Chang	2000	John Wiley & Sons
Optimizing wireless/RF circuits	John D Lenk	1999	McGraw-Hill
Three-Dimensional Modeling with Geoscientific Information Systems	A.K. Turner	1992	Springer Netherlands
An introduction to three-dimensional climate modeling /	Washington, Warren M.; Parkinson, Claire L.	[2005], ©2005.	University Science Books,
An introduction to three-dimensional climate modeling	Warren M. Washington	1986	University Science Books
Handbook of RF and Wireless Technologies	Farid Dowla	2004	Newnes
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications	Kazuo Kondo; Morihiro Kada; Kenji Takahashi	1st ed. 2015	Springer International Publishing
Three Dimensional System Integration: IC Stacking Process and Design	Antonis Papanikolaou; Dimitrios Soudris; Riko Radojcic	2011	Springer US
TSV 3D RF Integration	Shenglin Ma; Yufeng Jin	2022	Elsevier
RF Engineering for Wireless Networks	Daniel M. Dobkin	2005	Newnes
The Essential Guide to RF and Wireless	Carl J. Weisman	December 13, 1999	Prentice Hall PTR
Circuits & devices for RF wireless networks	IEEE Solid-State Circuits Society		IEEE
RF power amplifiers for wireless communications /	Cripps, Steve C.	[1999], ©1999.	Artech House,
RF Power Amplifier Behavioral Modeling	Dominique Schreurs; Máirtín O'Droma; Anthony A. Goacher; Michael Gadringer	2008-10	Cambridge University Press
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Chapter	Author(s)	Book	Book Authors	Year	Publisher
RF/Wireless Packaging		Encyclopedia of RF and Microwave Engineering: 6 Volume Set	Kai Chang (editor)	2005	Wiley-Interscience
RF/Wireless Packaging		Encyclopedia of RF and Microwave Engineering, 6-Volume Set	Kai Chang	2005	John Wiley & Sons, Inc.
RF Wireless Integration	H. F. F. Jos	2003 International Symposium on VLSI Technology, Systems, and Applications: VLSI 20th: proceedings of technical papers: October 6-8, 2003, Ambassador Hotel, Hsinchu, Taiwan, ROC.	International Symposium on VLSI Technology, Systems, and Applications (20th 2003 Hsinchu, Taiwan)	[2003], ©2003.	IEEE,
Three-Dimensional Die Packaging		Mechanical Engineering Handbook	Ed. Frank Kreith
7. Three-Dimensional Packaging		Multichip module design, fabrication, and testing /	Licari, James J.,	[1995], ©1995.	McGraw-Hill,
Temporary Bonding for Enabling Three-Dimensional Integration and Packaging	Rama Puligadda	Handbook of Wafer Bonding	Peter Ramm	2012	John Wiley & Sons
Three-Dimensional Integration	Philip Garrou; James Jian-Qiang Lu; Peter Ramm	Handbook of Wafer Bonding	Peter Ramm	2012	John Wiley & Sons
Integration and Packaging for RF MEMS Devices		RF MEMS and their Applications	Vijay K. Varadan	2002	John Wiley & Sons
Three-Dimensional Modeling	Clare P. Rowe	Drawing &a; Rendering for Theatre: A Practical Course for Scenic, Costume, and Lighting Designers	Clare Rowe	2007	Routledge
Three-dimensional Modeling	Luc Jaulin	Mobile Robotics	Luc Jaulin	2016	Elsevier
Three-Dimensional Modeling		Plan Graphics for the Landscape Designer: With Section-Elevation and Computer Graphics	Tony Bertauski	2018	Waveland Pr Inc
three-dimensional modeling		Vehicle-bridge interaction dynamics: with applications to high-speed railways /	Yang, Yeong-Bin,; Yao, Zhongda.; Wu, Y. S.	©2004.	World Scientific,
Three-dimensional Modeling		Mobile Robotics, Second Edition	Luc Jaulin	2019	John Wiley & Sons
RF-MEMS: materials and technology, integration and packaging	Harrie A. C. Tilmans	Materials, integration and packaging issues for high-frequency devices: symposium held December 1-3, 2003, Boston, Massachusetts, U. S. A. /	Muralt, P.	[2004], ©2004.	Materials Research Society,
Three-Dimensional Technology and Packaging Techniques	Brajesh Kumar Kaushik; Vobulapuram Ramesh Kumar; Manoj Kumar Majumder; Arsalan Alam	Through Silicon Vias: Materials, Models, Design, and Performance	Brajesh Kumar Kaushik; Vobulapuram Ramesh Kumar; Manoj Kumar Majumder; Arsalan Alam	2016	Routledge
14. Multichip and three-dimensional packaging	James Lyke	Advanced electronic packaging.	Brown, William D.,; Ulrich, Richard K.	c2006.	IEEE,
Three-Dimensional Modeling and Animation	Richard Lewis; James Luciana	Digital Media Foundations: An Introduction for Artists and Designers	Richard Lewis; James Luciana	2020	Routledge
Three-Dimensional Scanning and Modeling	Bernard Frischer	The Oxford Handbook of Roman Sculpture	Elise A. Friedland; Melanie Grunow Sobocinski; Elaine K. Gazda	2015	Oxford University Press
Three Dimensional View Integration	Denis Laurendeau	Computer Vision: A Reference Guide	Katsushi Ikeuchi	2014	Springer US
Three-Dimensional View Integration	Denis Laurendeau	Computer Vision: A Reference Guide	Katsushi Ikeuchi	2nd ed. 2021	Springer International Publishing
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 1 to 20 of 100 entries

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