"Wireless Interface Technologies for 3D IC and Module Integration"

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Book	Author(s)	Year	Publisher
Wireless Interface Technologies for 3D IC and Module Integration	Tadahiro Kuroda; Wai-Yeung Yip	2021-09	Cambridge University Press
3D Integration in VLSI Circuits: Implementation Technologies and Applications	Katsuyuki Sakuma; Krzysztof Iniewski	2018	Routledge
Technologies for Wireless Computing	Anantha P. Chandrakasan, Robert W. Brodersen (auth.), Anantha P. Chandrakasan, Robert W. Brodersen (eds.)	1996	Springer US
Technologies for Wireless Computing	Anantha P. Chandrakasan; Robert W. Brodersen	1996	Springer US
Technologies for wireless computing	Anantha P. Chandrakasan	1996	Kluwer Academic Publishers
CMOS IC Design for Wireless Medical and Health Care	Zhihua Wang; Hanjun Jiang; Hong Chen	2014	Springer New York
3D Integration for VLSI Systems	Chuan Seng Tan; Kuan-Neng Chen; Steven J. Koester	2011	Routledge
Reliability Of Rohscompliant 2d And 3d Ic Interconnects	John H. Lau	2010	McGraw-Hill Professional Publishing
Advances in Analog and RF IC Design for Wireless Communication Systems	Gabriele Manganaro and Domine M. W. Leenaerts	2013	Academic Press
Wireless Data Technologies	Vern A. Dubendorf	2003	John Wiley & Sons
5G Wireless Technologies	Angeliki Alexiou	2017	The Institution of Engineering and Technology
Enabling Technologies for Wireless E-Business	Weidon Kou; Yelena Yesha	2006	Springer Berlin Heidelberg
Multi-Carrier Technologies for Wireless Communication	Carl R. Nassar; Bala Natarajan; Zhiqiang Wu; David A. Wiegandt; S. Alireza Zekavat; Steve Shattil	2002	Springer US
Key Technologies for 5G Wireless Systems	Vincent W. S. Wong; Robert Schober; Derrick Wing Kwan Ng; Li-Chun Wang	2017-03	Cambridge University Press
Multi-Carrier Technologies For Wireless Communication	Carl R. Nassar, B. Natarajan, Z. Wu, D. Wiegandt, S. A. Zekavat	2002	Kluwer
Mobile and Wireless Technologies 2016	Kuinam J Kim; Naruemon Wattanapongsakorn; Nikolai Joukov	1st ed. 2016	Springer Nature Singapore
Antenna and Array Technologies for Future Wireless Ecosystems	Yingjie Jay Guo; Richard W. Ziolkowski	2022	Wiley-IEEE Press
Metrology for 5G and Emerging Wireless Technologies (Telecommunications)	Tian Hong Loh (editor)	2022	The Institution of Engineering and Technology
Antenna and array technologies for future wireless ecosystems	Y. Jay Guo (editor); Richard W. Ziolkowski (editor)	2022	Wiley-IEEE
TSV 3D RF Integration	Shenglin Ma; Yufeng Jin	2022	Elsevier
Boook	Author(s)	Year	Publisher

Showing 1 to 20 of 100 entries

entries per page

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Showing 1 to 20 of 100 entries

Chapter	Author(s)	Book	Book Authors	Year	Publisher
Wireless Interface Technologies for 3D IC and Module Integration		Wireless Interface Technologies for 3D IC and Module Integration	Tadahiro Kuroda; Wai-Yeung Yip	2021-09	Cambridge University Press
Wireless Interface Technologies for 3D IC and Module Integration - Title page		Wireless Interface Technologies for 3D IC and Module Integration	Tadahiro Kuroda; Wai-Yeung Yip	2021-09	Cambridge University Press
3D IC Integration and 3D IC Packaging	John H. Lau	Semiconductor Advanced Packaging	John H. Lau	1st ed. 2021	Springer Nature Singapore
3D MEMS and IC Integration	Maaike M. Taklo, Nicolas Lietaer, Hannah R. Tofteberg, Timo Seppanen, Josef Prainsack, Josef Weber and Peter Ramm	Materials and technologies for 3-D integration: symposium held December 1-3, 2008, Boston, Massachusetts, U. S. A. /	Roozeboom, Fred.	2009.	Materials Research Society,
3D Integration for Wireless Multimedia	Georg Kimmich	Chips 2020: A Guide to the Future of Nanoelectronics	Bernd Hoefflinger	2012	Springer Berlin Heidelberg
3D IC Integration Since 2008	Philip Garrou; Peter Ramm; Mitsumasa Koyanagi	Handbook of 3D Integration Volume 3 - 3D Process Technology	Philip Garrou; Mitsumasa Koyanagi; Peter Ramm	2014	John Wiley & Sons
32 Module Integration Technologies		Cost-driven Design of Smart Microsystems	coll.	0
3D System Integration Technologies	Peter Ramm, Armin Klumpp, Reinhard Merkel, Josef Weber, Robert Wieland, Andreas Ostamann and Jurgen Wolf	Materials, technology and reliability for advanced interconnects and low-k dielectrics--2003: symposium held April 21-25, 2003, San Francisco, California, U. S. A /	McKerrow, Andrew J.	[2003], ©2003.	Materials Research Society,
3D IC Heterogeneous Integration by FOWLP	John H. Lau	Fan-Out Wafer-Level Packaging	John H. Lau	1st ed. 2018	Springer Nature Singapore
222 3D IC Integration with WLP		Advanced MEMS Packaging (Electronic Engineering)	John Lau, Cheng Lee, C. Premachandran, Yu Aibin	2009	McGraw-Hill Education
3D User Interface Technologies and Games	Arun K. Kulshreshth; Joseph J. LaViola Jr.	Designing Immersive Video Games Using 3DUI Technologies: Improving the Gamer' s User Experience	Arun K. Kulshreshth; Joseph J. LaViola Jr.	1st ed. 2018	Springer International Publishing
Wafer and Die Bonding Technologies for 3D Integration	Shari Farrens	Materials and technologies for 3-D integration: symposium held December 1-3, 2008, Boston, Massachusetts, U. S. A. /	Roozeboom, Fred.	2009.	Materials Research Society,
Inductive Coupling ThruChip Interface for 3D Integration	Rohit Sharma; Krzysztof Iniewski; Sung Kyu Lim	Design of 3D Integrated Circuits and Systems	Rohit Sharma; Krzysztof Iniewski	2015	Routledge
Overview of Bonding Technologies for 3D Integration	Jean-Pierre Joly	Handbook of 3D Integration - Technology and Applications of 3D Integrated Circuits	Philip Garrou; Christopher Bower; Peter Ramm	2008	John Wiley & Sons
3D Integration Technologies: An Overview	Dingyou Zhang; James J.-Q. Lu	Materials for Advanced Packaging	Daniel Lu; C.P. Wong	2nd ed. 2017	Springer International Publishing
3D Integration Technologies – An Overview	Rajen Chanchani	Materials for Advanced Packaging	Daniel Lu; C.P. Wong	2009	Springer US
3D Integration Technologies at IMEC	Eric Beyne	Handbook of 3D Integration - Technology and Applications of 3D Integrated Circuits	Philip Garrou; Christopher Bower; Peter Ramm	2008	John Wiley & Sons
2D, 2. 1D, and 2. 3D IC Integration	John H. Lau	Semiconductor Advanced Packaging	John H. Lau	1st ed. 2021	Springer Nature Singapore
Steiner Routing for 3D IC	Sung Kyu Lim	Design for High Performance, Low Power, and Reliable 3D Integrated Circuits	Sung Kyu Lim	2012	Springer New York
Buffer Insertion for 3D IC	Sung Kyu Lim	Design for High Performance, Low Power, and Reliable 3D Integrated Circuits	Sung Kyu Lim	2012	Springer New York
Chapter	Author(s)	Book	Book Authors	Year	Publisher

Showing 1 to 20 of 100 entries

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